[Federal Register: March 25, 1996 (Rules and Regulations)]
[Page 12964-13014]
From the Federal Register Online via GPO Access [wais.access.gpo.gov]
 
[[pp. 12964-13014]] Export Administration Regulation; Simplification of Export 
Administration Regulations

[[Continued from page 12963]]

[[Page 12964]]

    d.2. A horizontal straightness of less (better) than 2 
micrometer per 300 mm length; and
    d.3. A vertical straightness of less (better) than 2 micrometer 
per 300 mm length;
    e. Single point diamond cutting tool inserts, having all of the 
following characteristics:
    e.1. Flawless and chip-free cutting edge when magnified 400 
times in any direction;
    e.2. Cutting radius from 0.1 to 5 mm inclusive; and
    e.3. Cutting radius out-of-roundness less (better) than 0.002 mm 
TIR.


2B009  Specially designed printed circuit boards with mounted 
components, or ``compound rotary tables'' or ``tilting spindles'', 
capable of upgrading, according to the manufacturer's specifications, 
``numerical control'' units, machine tools or feed-back devices to or 
above the levels specified in ECCNs 2B001, 2B002, 2B003, 2B004, 2B005, 
2B006, 2B007, or 2B008.

License Requirements

    Reason for Control: NS, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NS applies to entire entry.............  NS Column 2.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2B018  Equipment on the International Munitions List.

License Requirements

    Reason for Control: NS, MT, RS, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NS applies to entire entry.............  NS Column 1.                   
MT applies to specialized machinery,     MT Column 1.                   
 equipment, and gear for producing                                      
 rocket systems (including ballistic                                    
 missile systems, space launch                                          
 vehicles, and sounding rockets) and                                    
 unmanned air vehicle systems                                           
 (including cruise missile systems,                                     
 target drones, and reconnaissance                                      
 drones) usable in systems that are                                     
 controlled for MT reasons including                                    
 their propulsion systems and                                           
 components, and pyrolytic deposition                                   
 and densification equipment.                                           
RS applies to entire entry.............  RS Column 2.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: $3000
    GBS: Yes for Advisory Note in this entry to 2B018
    CIV: N/A

List of Items Controlled

    Unit: Equipment in number; parts and accessories in Sec. value
    Related Controls: N/A
    Related Definitions: N/A
    Items:

    Specialized machinery, equipment, gear, and specially designed 
parts and accessories therefor, including but not limited to the 
following, that are specially designed for the examination, 
manufacture, testing, and checking of arms, appliances, machines, 
and implements of war:
    a. Armor plate drilling machines, other than radial drilling 
machines;
    b. Armor plate planing machines;
    c. Armor plate quenching presses;
    d. Centrifugal casting machines capable of casting tubes 6 feet 
(183 cm) or more in length, with a wall thickness of 2 inches (5 cm) 
and over;
    e. Gun barrel rifling and broaching machines, and tools 
therefor;
    f. Gun barrel rifling machines;
    g. Gun barrel trepanning machines;
    h. Gun boring and turning machines;
    i. Gun honing machines of 6 feet (183 cm) stroke or more;
    j. Gun jump screw lathes;
    k. Gun rifling machines;
    l. Gun straightening presses;
    m. Induction hardening machines for tank turret rings and 
sprockets;
    n. Jigs and fixtures and other metal-working implements or 
accessories of the kinds exclusively designed for use in the 
manufacture of firearms, ordnance, and other stores and appliances 
for land, sea, or aerial warfare;
    o. Small arms chambering machines;
    p. Small arms deep hole drilling machines and drills therefor;
    q. Small arms rifling machines;
    r. Small arms spill boring machines;
    s. Tank turret bearing grinding machines.

    Advisory Note: Licenses are likely to be approved, as 
administrative exceptions, for export and reexport to Country Group 
D:1 of equipment used to determine the safety data of explosives, as 
required by the International Convention on the Transport of 
Dangerous Goods (C.I.M.) articles 3 and 4 in Annex 1 RID, provided 
that such equipment will be used only by the railway authorities of 
current C.I.M. members, or by the Government-accredited testing 
facilities in those countries, for the testing of explosives to 
transport safety standards, of the following description:

    a. Equipment for determining the ignition and deflagration 
temperatures;
    b. Equipment for steel-shell tests;
    c. Drophammers not exceeding 20 kg in weight for determining the 
sensitivity of explosives to shock;
    d. Equipment for determining the friction sensitivity of 
explosives when exposed to charges not exceeding 36 kg in weight.


2B104   Equipment and process controls designed or modified for 
densification and pyrolysis of structural composite rocket nozzles and 
reentry vehicle nose tips.

License Requirements

    Reason for Control: MT, NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
MT applies to entire entry.............  MT Column 1.                   
NP applies to 2B104.a..................  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: Equipment in number
    Related Controls: N/A
    Related Definitions: N/A
    Items: a. ``Isostatic presses'' other than those controlled by 
2B004 having all of the following characteristics:

    a.1. Capable of achieving a maximum working pressure of 10,000 
psi (69 MPa) or greater;
    a.2. Designed to achieve and maintain a controlled thermal 
environment of 873 K (600 deg. C) or greater; and
    a.3. Possessing a chamber cavity with an inside diameter of 254 
mm or greater;
    b. Chemical vapor deposition furnaces designed or modified for 
the densification of carbon-carbon composites.


2B115  Flow forming machines, and specially designed components 
therefor.

License Requirements

    Reason for Control: MT, NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
MT applies to entire entry.............  MT Column 1.                   
NP applies to 2B115.a..................  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: Equipment in number; parts and accessories in $ value
    Related Controls: N/A
    Related Definition: This entry controls only spin-forming 
machines combining the functions of spin-forming and flow-forming.
    Items: a. Flow-forming and spin-forming machines, and specially 
designed components therefor, that according to the manufacturer's 
technical specifications, can be equipped with ``numerical control'' 
units or a computer control; and

    b. Having more than two axes that can be coordinated 
simultaneously for ``contouring control''.

[[Page 12965]]



2B116  Vibration test systems, equipment, and components therefor.

License Requirements

    Reason for Control: MT, NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
MT applies to entire entry.............  MT Column 1.                   
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: $3,000
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definitions: NOTE: The term ``digital control'' refers 
to equipment, the functions of which are, partly or entirely, 
automatically controlled by stored and digitally coded electrical 
signals.
    Items: a. Vibration test systems employing feedback or closed 
loop techniques and incorporating a digital controler, capable of 
vibrating a system at 10 g RMS or more over the entire range 20 Hz 
to 2,000 Hz and imparting forces of 50 kN (11,250 lbs.), measured 
``bare table'', or greater;

    Note: NP controls in 2B116.a apply to electrodynamic vibration 
test systems, employing feedback or closed loop control techniques 
and incorporating a digital controller, capable of vibrating at 10 g 
RMS or more between 20 Hz and 2000 Hz and imparting forces of 50 kN 
(11,250 lbs.) measured ``bare table,'' or greater.

    b. Digital controllers, combined with specially designed 
vibration test ``software'', with a real-time bandwidth greater than 
5 kHz and designed for use with vibration test systems described in 
2B116.a;
    c. Vibration thrusters (shaker units), with or without 
associated amplifiers, capable of imparting a force of 50 kN (11,250 
lbs.), measured ``bare table'', or greater, and usable in vibration 
test systems described in 2B116.a;
    d. Test piece support structures and electronic units designed 
to combine multiple shaker units into a complete shaker system 
capable of providing an effective combined force of 50 kN, measured 
``bare table'', or greater, and usable in vibration test systems 
described in 2B116.a.


2B204  ``Isostatic presses,'' not controlled by 2B004 or 2B104, capable 
of achieving a maximum working pressure of 10,000 psi (69 MPa) or 
greater and having a chamber cavity with an inside diameter in excess 
of 152 mm (6 inches) and specially designed dies and moulds, and 
controls therefor.

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: Equipment in number
    Related Controls: N/A
    Related Definition: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2B207  ``Robots'', and ``end-effectors'', other than those controlled 
by 2B007, specially designed to comply with safety standards applicable 
to handling explosives (i.e., meeting electrical code ratings for high 
explosives) and specially designed controllers therefor.

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2B215  Flow-forming and spin-forming machines other than those 
controlled by 2B115, and rotor-forming mandrels.

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: Equipment in number; parts and accessories in $ value
    Related Controls: N/A
    Related Definition: This entry controls only spin-forming 
machines combining the functions of spin-forming and flow-forming.
    Items: a. Having three or more rollers (active or guiding); and
    a.1. According to the manufacturer's technical specifications, 
can be equipped with ``numerical control'' units or a computer 
control;
    b. Rotor-forming mandrels designed to form cylindrical rotors of 
inside diameter between 75 mm (3 in.) and 400 mm (16 in.).

    Note: This entry includes machines which have only a single 
roller designed to deform metal plus two auxiliary rollers which 
support the mandrel, but do not participate directly in the 
deformation process.


2B225  Remote manipulators that can be used to provide remote actions 
in radiochemical separation operations and hot cells.

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definition: Remote manipulators provide translation of 
human operator actions to a remote operating arm and terminal 
fixture. They may be of a `master/slave' type or operated by 
joystick or keypad.
    Items:

    a. Having a capability of penetrating 0.6 m or more of hot cell 
wall (through-the-wall operation); or
    b. Having a capability of bridging over the top of a hot cell 
wall with a thickness of 0.6 m or more (over-the-wall operation)


2B226  Vacuum and controlled environment (inert gas) induction) 
furnaces capable of operating above 1,123 K (850'C) and having 
induction coils 600 mm or less in diameter and designed for power 
inputs of 5 kW or more, and power supplies specially designed therefor 
with a specified power output of 5 kW or more.

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definition: This entry does not control furnaces 
designed for semiconductor wafer manufacturing or processing.
    Items: The list of items controlled is contained in the ECCN 
heading.

[[Page 12966]]



2B227  Vacuum and controlled atmosphere metallurgical melting and 
casting furnaces, and specially configured computer control and 
monitoring systems therefor.

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definition: Related Definition: This entry does not 
control furnaces designed for semiconductor wafer manufacturing or 
processing.
    Items:

    a. Arc remelt and casting furnaces with consumable electrode 
capacities between 1,000 cm<SUP>3 and 20,000 cm<SUP>3, and capable 
of operating with melting temperatures above 1,973 K (1,700 deg. C);
    b. Electron beam melting and plasma atomization and melting 
furnaces with a power of 50 kW or greater and capable of operating 
with melting temperatures above 1,473 K (1,200 deg. C).


2B228  Rotor fabrication and assembly equipment and bellows-forming 
mandrels and dies.

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definition: N/A
    Items:

    a. Rotor assembly equipment (e.g., precision mandrels, clamps, 
and shrink fit machines) for assembly of gas centrifuge rotor tube 
sections, baffles, and end caps.
    b. Rotor straightening equipment for alignment of gas centrifuge 
rotor tube sections to a common axis;

    Technical Note: Normally such equipment will consist of 
precision measuring probes linked to a computer that subsequently 
controls the action of, for example, pneumatic rams used for 
aligning the rotor tube sections.

    c. Bellows-forming mandrels and dies for producing single-
convolution bellows (bellows made of high-strength aluminum alloys, 
maraging steel, or high-strength filamentary materials) that have 
all of the following dimensions:
    c.1. 75 mm to 400 mm (3 in. to 6 in.) inside diameter;
    c.2. 12.7 mm (0.5 in) or more in length; and
    c.3. Single convolution depth more than 2 mm (0.08 in.).


2B229  Centrifugal balancing machines, fixed or portable, horizontal or 
vertical.

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definitions: N/A
    Items: a. Designed for balancing flexible rotors having a length 
of 600 mm (24 in.) or more and having all of the following 
characteristics:
    a.1. A swing or journal diameter of 75 mm (3 in.) or more;
    a.2. Mass capability for 0.9 kg (2 lb.) to 23 kg (50 lb.); and
    a.3. Capable of balancing speed of more than 5,000 rpm;
    b. Designed for balancing hollow cylindrical rotor components, 
and having all of the following characteristics:
    b.1. A journal diameter of 75 mm (3 in.) or more;
    b.2. Mass capability from 0.9 kg (2 lb.) to 23 kg (50 lb.);
    b.3. Capable of balancing to a residual imbalance of 0.010 kg-
mm/kg per plane or better; and
    b.4. Belt drive type.


2B230  Pressure transducers which are capable of measuring absolute 
pressure at any point in the range 0 to 13 kPa, with pressure sensing 
elements made of or protected by nickel, nickel alloys with more than 
60% nickel by weight, aluminum or aluminum alloys.

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definitions: (1.)Pressure transducers are devices that 
convert pressure measurements into an electrical signal. (2.) For 
the purposes of this entry, ``accuracy'' includes non-linearity, 
hysteresis and repeatability at ambient temperature.
    Items:

    a. Transducers with a full scale of less than 13 kPa and an 
accuracy of better than <plus-minus> 1% of full scale;
    b. Transducers with a full scale of 13 kPa or greater and an 
accuracy of better than <plus-minus> 130 Pa.


2B231  Vacuum pumps with an input throat size of 38 cm (15 in.) or 
greater with a pumping speed of 15,000 liters/second or greater and 
capable of producing an ultimate vacuum better than 10\4\ Torr 
(1.33 x 10<SUP>-4 mbar).

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: Vacuum pumps for gaseous diffusion separation 
process are subject to the export licensing authority of the Nuclear 
Regulatory Commission. (See 10 CFR part 110.)
    Related Definition: (1.) The ultimate vacuum is determined at 
the input of the pump with the input of the pump blocked off. (2.) 
The pumping speed is determined at the measurement point with 
nitrogen gas or air.
    Items: The list of items controlled is contained in the ECCN 
heading.


2B232  Multistage light gas guns or other high-velocity gun systems 
(coil, electromagnetic, electrothermal, or other advanced systems) 
capable of accelerating projectiles to 2 km/s or greater and 
specialized components therefor.

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definitions: N/A
    
[[Page 12967]]

    Items: The list of items controlled is contained in the ECCN 
heading.


2B290  ``Numerically controlled'' machine tools not controlled by 
2B001.

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: Equipment in number; parts and accessories in Sec. value
    Related Controls: N/A
    Related Definition: N/A
    Items:

    a. Turning machines or combination turning/milling machines that 
are capable of machining diameters greater than 2.5 meters.
    b. Reserved.


2B350  Chemical manufacturing facilities and equipment.

License Requirements

    Reason for Control: CB, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
CB applies to entire entry.............  CB Column 3.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: Equipment in number
    Related Controls: The controls in this entry do not apply to 
equipment that is; a.) specially designed for use in civil 
applications (e.g., food processing, pulp and paper processing, or 
water purification); AND b.) inappropriate, by the nature of its 
design, for use in storing, processing, producing or conducting and 
controlling the flow of chemical weapons precursors controlled by 
1C350.
    Related Definition: For purposes of this entry the term 
``chemical warfare agents'' are those agents subject to the export 
licensing authority of the U.S. Department of State, Office of 
Defense Trade Controls. (See 22 CFR Part 121, Category XIV)
    Items:

    a. Chemical processing equipment described in paragraph a.1 
having any of the flow contact surfaces described in paragraph a.2:
    a.1. Chemical processing equipment, as follows:
    a.1.a. Reaction vessels or reactors, with or without agitators, 
with a total internal (geometric) volume greater than 0.1 m<SUP>3 
(100 liters) and less than 20 m<SUP>3 (20,000 liters);
    a.1.b Agitators for use in reaction vessels or reactors 
described in 2B350.a.1.a;
    a.1.c. Storage tanks, containers or receivers with a total 
internal (geometric) volume greater than 0.1 m<SUP>3 (100 1);
    a.1.d. Heat exchangers or condensers with a heat transfer 
surface area less than 20 m<SUP>2;
    a.1.e. Distillation or absorption columns having a diameter 
greater than 0.1 m;
    a.1.f. Multiple seal valves incorporating a leak detection port, 
bellows-seal valves, non-return (check) valves or diaphragm valves; 
or
    a.1.g. Multi-walled piping incorporating a leak detection port;
    a.2. Where all surfaces that come into direct contact with the 
chemical(s) being processed or contained are made from any of the 
following materials:
    a.2.a. Nickel, or alloys with more than 40% nickel by weight;
    a.2.b. Alloys with more than 25% nickel and 20% chromium by 
weight;
    a.2.c. Fluoropolymers;
    a.2.d. Glass or glass-lined (including vitrified or enamelled 
coating);
    a.2.e. Graphite (for heat exchangers or condensers, distillation 
or absorption columns, or multi-walled piping only);
    a.2.f. Tantalum or tantalum alloys;
    a.2.g. Titanium or titanium alloys; or
    a.2.h. Zirconium or zirconium alloys.
    b. Remotely operated filling equipment in which all surfaces 
that come into direct contact with the chemical(s) being processed 
are made from any of the following materials:
    b.1. Nickel, or alloys with more than 40% nickel by weight; or
    b.2. Alloys with more than 25% nickel and 20% chromium by 
weight.
    c. Multi-seal, canned drive, magnetic, bellows, or diaphragm 
pumps, with manufacturer's specified maximum flow-rate greater than 
0.6m<SUP>3/h, or vacuum pumps with the manufacturer's specified 
maximum flow-rate greater than 5 m<SUP>3/h (under standard 
temperature (0 deg.C) and pressure (101.30 kPa) conditions) in which 
all surfaces that come into direct contact with the chemical(s) 
being processed are made from any of the following materials:
    c.1. Nickel, or alloys with more than 40% nickel by weight;
    c.2. Alloys with more than 25% nickel and 20% chromium by 
weight;
    c.3. Fluoropolymers;
    c.4. Glass or glass-lined (including vitrified or enamelled 
coating);
    c.5. Graphite;
    c.6. Tantalum or tantalum alloys;
    c.7. Titanium or titanium alloys;
    c.8. Zirconium or zirconium alloys;
    c.9. Ceramics; or
    c.10. Ferrosilicon.
    d. Incinerators that are designed to destroy chemical warfare 
agents, or chemical weapons precursors controlled by ECCN 1C350, 
having specially designed waste supply systems, special handling 
facilities with an average combustion chamber temperature greater 
than 1000 deg.C in which all surfaces in the waste supply system 
that come into direct contact with the waste products are made from 
or lined with any of the following materials:
    d.1. Nickel, or alloys with more than 40% nickel by weight;
    d.2. Alloys with more than 25% nickel and 20% chromium by 
weight; or
    d.3. Ceramics.


2B351  Toxic gas monitoring system; and dedicated detectors therefor.

License Requirements

    Reason for Control: CB, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
CB applies to entire entry.............  CB Column 3.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: Equipment in number
    Related Controls: N/A
    Related Definitions: N/A
    Items:

    a. Designed for continuous operation and usable for detecting 
chemical warfare agents controlled on the U.S. Munitions List (See 
22 CFR part 121) or chemical weapons precursors controlled by ECCN 
1C350, or detecting organic compounds containing phosphorus, 
sulphur, fluorine, or chlorine, or their compounds, at a 
concentration less than 0.3 mg/m<SUP>3; and
    b. Designed for the detection of chemical compounds having a 
cholinesterase-inhibiting activity.


2B352  Biological equipment.

License Requirements

    Reason for Control: CB, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
CB applies to entire entry.............  CB Column 3.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: Equipment in number
    Related Controls: N/A
    Related Definitions: N/A
    Items:

    a. Complete containment facilities at P3 or P4 containment 
level;

    Technical Note: P3 or P4 (BL3, BL4, L3, L4) containment levels 
are as specified in the WHO Laboratory Biosafety Manual (Geneva, 
1983).

    b. Fermenters capable of cultivation of pathogenic micro-
organisms, viruses or for toxin production, without the propagation 
of aerosols, having a capacity equal to or greater than 100 liters.

    Technical Note: Fermenters include bioreactors, chemostats, and 
continuous-flow systems.


[[Page 12968]]

    c. Centrifugal separators capable of the continuous separation 
of pathogenic microorganisms, without the propagation of aerosols, 
and having all of the following characteristics:
    c.1. A flow rate greater than 100 liters per hour;
    c.2. Components of polished stainless steel or titanium;
    c.3. Double or multiple sealing joints within the stream 
containment area;
    c.4. Capable of in situ stream sterilization in a closed state.

    Technical Note: Centifugal separators include decanters.

    d. Cross-flow filtration equipment capable of continuous 
separation of pathogenic microorganisms, viruses, toxins, and cell 
cultures without the propagation of aerosols, having all of the 
following characteristics:
    d.1. Equal to or greater than 5 square meters;
    d.2. Capable of in situ sterilization.
    e. Steam sterilizable freeze-drying equipment with a condenser 
capacity greater than 50 kgs. but less than 1,000 kgs. of ice in 24 
hours.
    f. Equipment that incorporates or is contained in P3 or P4 
containment housing, as follows:
    f.1. Independently ventilated protective full or half suits; and
    f.2. Class III biological safety cabinets or isolators with 
similar performance standards;

    Note: In this entry, isolators include flexible isolators, dry 
boxes, anaerobic chambers and glove boxes.

    g. Chambers designed for aerosol challenge testing with 
microorganisms, viruses, or toxins and having a capacity of 1 
m<SUP>3 or greater.


2B985  Equipment specially designed for manufacturing shotgun shells; 
and ammunition hand-loading equipment for both cartridges and shotgun 
shells.

License Requirements

    Reason for Control: UN

Control(s)

    UN applies to entire entry. A license is required for items 
controlled by this entry to Cuba, Libya, North Korea and Rwanda. The 
Commerce Country Chart is not designed to determine licensing 
requirements for this entry. See part 746 of the EAR for additional 
information.

    Note: Exports from the U.S. and transhipments to Iran must be 
licensed by the Department of Treasury, Office of Foreign Assets 
Control. (See to Sec. 746.7 of the EAR for additional information on 
this requirement.)

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2B991  Numerical control units for machine tools and ``numerically 
controlled'' machine tools, n.e.s

License Requirements

    Reason for Control: AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: Equipment in number
    Related Controls: N/A
    Related Definitions: N/A
    Items:

    a. ``Numerical control'' units for machine tools:
    a.1. Having four interpolating axes that can be coordinated 
simultaneously for ``contouring control''; or
    a.2. Having two or more axes that can be coordinated 
simultaneously for ``contouring control'' and a minimum programmable 
increment better (less) than 0.001 mm;
    b. ``Numerically controlled'' machine tools that, according to 
the manufacturer's technical specifications, can be equipped with 
electronic devices for simultaneous ``contouring control'' in two or 
more axes and that have both of the following characteristics:
    b.1. Two or more axes that can be coordinated simultaneously for 
contouring control; and
    b.2. ``Positioning accuracies'', with all compensations 
available:
    b.2.a. Better than 0.020 mm, but no better than 0.004 mm along 
any linear axis (overall positioning) for grinding machines;
    b.2.b. Better than 0.020 mm, but no better than 0.006 mm along 
any linear axis (overall positioning) for milling machines; or
    b.2.c. Better than 0.020 mm, but no better than 0.010 mm along 
any linear axis (overall positioning) for turning machines.


2B992  Manual dimensional inspection machines with two or more axes, 
and measurement uncertainty equal to or less (better) than (3 + L/300) 
micrometer in any axes (L measured length in mm).

License Requirements

    Reason for Control: AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled:

    Unit: Equipment in number
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2B993  Gearmaking and/or finishing machinery not controlled by 2B003 
capable of producing gears to a quality level of better than AGMA 11.

License Requirements

    Reason for Control: AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled:

    Unit: $ value
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2B994  ``Robots'' not controlled by 2B007 or 2B207 that are capable of 
employing feedback information in real-time processing from one or more 
sensors to generate or modify ``programs'' or to generate or modify 
numerical program data.

License Requirements

    Reason for Control: AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.

C. Materials [Reserved]

D. Software


2D001  ``Software'' specially designed or modified for the 
``development'', ``production'' or ``use'' of equipment controlled by 
2A001 to 2A007 or 2B001 to 2B009.

License Requirements

    Reason for Control: NS, MT, NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NS applies to entire entry.............  NS Column 1.                   
MT applies to ``software'' for           MT Column 1.                   
 equipment controlled by 2B004.                                         
NP applies to ``software'' for           NP Column 1.                   
 equipment controlled by 2B001, 2B004,                                  
 2B006, 2B007 for NP reasons.                                           
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------


[[Page 12969]]


License Exceptions

    CIV: N/A
    TSR: Yes

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2D002  Specific ``software.''

License Requirements

    Reason for Control: NS, NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NS applies to entire entry.............  NS Column 1.                   
NP applies to 2D002.b..................  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    CIV: N/A
    TSR: Yes

List of Items Controlled

    Unit: Sec. value
    Related Controls: N/A
    Related Definitions: N/A
    Items:

    a. ``Software'' to provide ``adaptive control'' and having both 
of the following characteristics:
    a.1. For ``flexible manufacturing units'' (FMUs) which consist 
at least of equipment described in b.1 and b.2 of the definition of 
``flexible manufacturing unit'' contained in part 772 of the EAR; 
and
    a.2. Capable of generating or modifying, in ``real time 
processing'', programs or data by using the signals obtained 
simultaneously by means of at least two detection techniques, such 
as:
    a.2.a. Machine vision (optical ranging);
    a.2.b. Infrared imaging;
    a.2.c. Acoustical imaging (acoustical ranging);
    a.2.d. Tactile measurement;
    a.2.e. Inertial positioning;
    a.2.f. Force measurement;
    a.2.g. Torque measurement;

    Note: 2D002.a does not control ``software'' which only provides 
rescheduling of functionally identical equipment within ``flexible 
manufacturing units'' using pre-stored part programs and a pre-
stored strategy for the distribution of the part programs.

    b. ``Software'' for electronic devices other than those 
described in 2B001.a or b, which provides the ``numerical control'' 
capability of the equipment controlled by 2B001.


2D018   ``Software'' for the ``development'', ``production'' or ``use'' 
of equipment controlled by 2B018.

License Requirements

    Reason for Control: NS, MT, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NS applies to entire entry.............  NS Column 1.                   
MT applies to ``software'' for           MT Column 1.                   
 equipment controlled by 2B018 for MT                                   
 reasons.                                                               
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    CIV: N/A
    TSR: Yes

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2D101   ``Software'' for the ``development'', ``production'', or 
``use'' of items controlled by 2B104, 2B115 or 2B116.

License Requirements

    Reason for Control: MT, NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
MT applies to entire entry.............  MT Column 1.                   
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    CIV: N/A
    TSR: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2D201   ``Software'' specially designed for the ``development'', 
``production'' or ``use'' of items controlled by 2B204, 2B207, 2B215, 
2B227 or 2B229.

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    CIV: N/A
    TSR: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2D290   ``Software'' specially designed or modified for the 
``development'', ``production'' or ``use'' of items controlled by 
2A290, 2A291 or 2B290.

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to ``software'' for           NP Column 1.                   
 equipment controlled by 2A291 or 2B290.                                
NP applies to ``software'' for           NP Column 2.                   
 equipment controlled by 2A290.                                         
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    CIV: N/A
    TSR: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2D992   ``Software'' specially designed for the ``development'' or 
``production'' of equipment controlled by 2B992.

License Requirements

    Reason for Control: AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    CIV: N/A
    TSR: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2D993   ``Software'' specially designed for the ``development'', 
``production'', or ``use'' of equipment controlled by 2B991, 2B993, or 
2B994.

License Requirements

    Reason for Control: AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    CIV: N/A
    TSR: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2D994   ``Software'' specially designed for the ``development'' or 
``production'' of portable electric generators controlled by 2A994.

License Requirements

    Reason for Control: AT
    
[[Page 12970]]


Control(s)

    AT applies to entire entry. A license is required for items 
controlled by this entry to Cuba, Iran, Libya, and North Korea. The 
Commerce Country Chart is not designed to determine licensing 
requirements for this entry. See part 746 of the EAR for additional 
information.

    Note: Exports from the U.S. and transhipments to Iran must be 
licensed by the Department of Treasury, Office of Foreign Assets 
Control. (See Sec. 742.8 and Sec. 746.7 for additional information 
on this requirement.)

License Exceptions

    CIV: N/A
    TSR: N/A

List of Items Controlled

    Unit: $ value
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.

E. Technology


2E001   ``Technology'' according to the General Technology Note for the 
``development'' of items controlled by 2A (except 2A993 and 2A994) or 
2B (except 2B018, 2B991 to 2B994) 2D (except 2D018, 2D992 to 2D994)

License Requirements

    Reason for Control: NS, MT, NP, CB, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NS applies to ``technology'' for items   NS Column 1.                   
 controlled by 2A001 to 2A006, 2B001 to                                 
 2B009, 2D001 or 2D002.                                                 
MT applies to ``technology'' for items   MT Column 1.                   
 controlled by 2B004, 2B018 or 2B116,                                   
 2D001 or 2D101 for MT reasons.                                         
NP applies to ``technology'' for items   NP Column 1.                   
 controlled by 2A292, 2A293, 2B001,                                     
 2B004, 2B006, 2B007, 2B104, 2B215,                                     
 2B225, 2B226, 2B228, 2B229, 2B231,                                     
 2B290, 2D001, 2D002 or 2D201 for NP                                    
 reasons.                                                               
NP applies to ``technology'' for         NP Column 2.                   
 equipment controlled by 2A290.                                         
CB applies to ``technology'' for         CB Column 3.                   
 equipment controlled by 2B350 to 2B352.                                
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    CIV: N/A
    TSR: Yes

List of Items Controlled

    Unit: N/A
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2E002   ``Technology'' according to the General Technology Note for the 
``production'' of items controlled by 2A (except 2A993 and 2A994) or 2B 
(except 2B018, 2B991 to 2B994).

License Requirements

    Reason for Control: NS, MT, NP, CB, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NS applies to ``technology'' for         NS Column 1.                   
 equipment controlled by 2A001 to                                       
 2A006, 2B001 to 2B009.                                                 
MT applies to ``technology'' for         MT Column 1.                   
 equipment controlled by 2B004, 2B018,                                  
 and 2B116 for MT reasons.                                              
NP applies to ``technology'' for         NP Column 1.                   
 equipment controlled by 2A292, 2A293,                                  
 2B001, 2B004, 2B006, 2B007, 2B104,                                     
 2B215, 2B225, 2B226, 2B228, 2B229,                                     
 2B231, 2B290 NP reasons.                                               
NP applies to ``technology'' for         NP Column 2.                   
 equipment controlled by 2A290.                                         
CB applies to ``technology'' for         CB Column 3.                   
 equipment controlled by 2B350 to 2b352.                                
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    CIV: N/A
    TSR: Yes

List of Items Controlled

    Unit: N/A
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2E003  Other ``technology''.

License Requirements

    Reason for Control: NS, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NS applies to entire entry.............  NS Column 1.                   
NP applies to ``technology'' controlled  NP Column 1.                   
 by 2E003.a.1 or a.3..                                                  
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    CIV: N/A
    TSR: Yes, except 2E003.a.1, a.3, .b, and .d

List of Items Controlled

    Unit: N/A
    Related Controls: N/A
    Related Definitions: N/A
    Items:

    a. ``Technology'':

    a.1  For the ``development'' of interactive graphics as an 
integrated part in ``numerical control'' units for preparation or 
modification of part programs;
    a.2  For the ``development'' of generators of machine tool 
instructions (e.g., part programs) from design data residing inside 
``numerical control'' units;
    a.3  For the ``development'' of integration ``software'' for 
incorporation of expert systems for advanced decision support of 
shop floor operations into ``numerical control'' units;
    b. ``Technology'' for metal-working manufacturing processes, as 
follows:
    b.1. ``Technology'' for the design of tools, dies or fixtures 
specially designed for the following processes:
    b.1.a. ``Superplastic forming'';
    b.1.b. ``Diffusion bonding'';
    b.1.c. ``Direct-acting hydraulic pressing'';
    b.2. ``Technology'' consisting of process methods or parameters 
as listed below used to control:
    b.2.a. ``Superplastic forming'' of aluminium alloys, titanium 
alloys or ``superalloys'':
    b.2.a.1. Surface preparation;
    b.2.a.2. Strain rate;
    b.2.a.3. Temperature;
    b.2.a.4. Pressure;
    b.2.b. ``Diffusion bonding'' of ``superalloys'' or titanium 
alloys:
    b.2.b.1. Surface preparation;
    b.2.b.2. Temperature;
    b.2.b.3. Pressure;
    b.2.c. ``Direct-acting hydraulic pressing'' of aluminium alloys 
or titanium alloys:
    b.2.c.1. Pressure;
    b.2.c.2. Cycle time;
    b.2.d. ``Hot isostatic densification'' of titanium alloys, 
aluminium alloys or ``superalloys'':
    b.2.d.1. Temperature;
    b.2.d.2. Pressure;
    b.2.d.3. Cycle time;
    c. ``Technology'' for the ``development'' or ``production'' of 
hydraulic stretch-forming machines and dies therefor, for the 
manufacture of airframe structures;
    d. ``Technology'' for:
    d.1 The application of inorganic overlay coatings or inorganic 
surface modification coatings, specified in column 3 of the 
following Table;
    d.2 To non-electronic substrates, specified in column 2 of the 
following Table;
    d.3 By processes specified in column 1 of the following Table 
and defined in the Technical Note;

     Category 2E--Materials Processing Table; Deposition Techniques     
------------------------------------------------------------------------
   1. Coating Process (1)         2. Substrate      3. Resultant Coating
------------------------------------------------------------------------
A. Chemical Vapor Deposition  ``Superalloys''.....  Aluminides for      
 (CDV).                                              internal passages. 

[[Page 12971]]
                                                                        
                              Ceramics and Low-     Silicides.          
                               expansion glasses    Carbides.           
                               (14).                Dielectric layers   
                                                     (15).              
                              Carbon-carbon,        Silicides.          
                               Ceramic, and Metal   Carbides.           
                               matrix composites.   Refractory metals.  
                                                    Mixtures thereof    
                                                     (4).               
                                                    Dielectric layers   
                                                     (15).              
                                                    Aluminides          
                                                    Alloyed aluminides  
                                                     (2).               
                              Cemented tungsten     Carbides.           
                               carbide (16),        Tungsten.           
                               Silicon carbide.     Mixtures thereof.   
                                                     (4)                
                                                    Dielectric layers   
                                                     (15).              
                              Molybdenum and        Dielectric layers   
                               Molybdenum alloys.    (15).              
                              Beryllium and         Dielectric layers   
                               Beryllium alloys.     (15).              
                              Sensor window         Dielectric layers   
                               materials (9).        (15).              
B. Thermal-Evaporation                                                  
 Physical Vapor Deposition                                              
 (TE-PVD).                                                              
    1. Physical Vapor         ``Superalloys''.....  Alloyed silicides.  
     Deposition (PVD):                              Alloyed aluminides  
     Electron-Beam (EB-PVB).                         (2).               
                                                    MCrAlx (5).         
                                                    Modified zirconia   
                                                     (12).              
                                                    Silicides.          
                                                    Aluminides.         
                                                    Mixtures thereof    
                                                     (4).               
                              Ceramics and Low-     Dielectric layers   
                               expansion glasses     (15).              
                               (14).                                    
                              Corrosion resistant   MCrAlx (5).         
                               steel (7).           Modified zirconia   
                                                     (12).              
                                                    Mixtures thereof    
                                                     (4).               
                              Carbon-carbon,        Silicides.          
                               Ceramic and Metal    Carbides.           
                               matrix composites.   Refractory metals.  
                                                    Mixtures thereof    
                                                     (4).               
                                                    Dielectric layers   
                                                     (15).              
                              Cemented tungsten     Carbides.           
                               carbide (16),        Tungsten.           
                               Silicon carbide.     Mixtures thereof (4)
                                                    Dielectric layers   
                                                     (15).              
                              Molybdenum and        Dielectric layers   
                               Molybdenum alloys.    (15).              
                              Beryllium and         Dielectric layers   
                               Beryllium alloys.     (15).              
                                                    Borides.            
                              Sensor window         Dielectric layers   
                               materials (9).        (15).              
                              Titanium alloys (13)  Borides.            
                                                    Nitrides.           
    2. Ion assisted           Ceramics and Low-     Dielectric layers   
     resistive heating         expansion glasses     (15).              
     Physical Vapor            (14).                                    
     Deposition (Ion                                                    
     Plating).                                                          
                              Carbon-carbon,        Dielectric layers   
                               Ceramic and Metal     (15).              
                               matrix composites.                       
                              Cemented tungsten     Dielectric layers   
                               carbide (16),         (15).              
                               Silicon carbide.                         
                              Molybdenum and        Dielectric layers   
                               Molybdenum alloys.    (15).              
                              Beryllium and         Dielectric layers   
                               Beryllium alloys.     (15).              
                              Sensor window         Dielectric layers   
                               materials (9).        (15).              
    3. Physical Vapor         Ceramics and Low-     Silicides.          
     Deposition: ``laser''     expansion glasses    Dielectric layers   
     evaporation.              (14).                 (15).              
                              Carbon-carbon,        Dielectric layers   
                               Ceramic and Metal     (15).              
                               matrix composites.                       
                              Cemented tungsten     Dielectric layers   
                               carbide (16),         (15).              
                               Silicon carbide.                         
                              Molybdenum and        Dielectric layers   
                               Molybdenum alloys.    (15).              
                              Beryllium and         Dielectric layers   
                               Beryllium alloys.     (15).              
                              Sensor window         Dielectric layers   
                               materials (9).        (15).              
    4. Physical Vapor         ``Superalloys''.....  Alloyed silicides.  
     Deposition: cathodic                           Alloyed aluminides  
     arc discharge.                                  (2).               
                                                    MCrAlx (5).         
                              Polymers (11) and     Borides.            
                               Organic matrix       Carbides.           
                               composites.          Nitrides.           
C. Pack cementation (see A    Carbon-carbon,        Silicides.          
 above for out-of-pack         Ceramic and Metal    Carbides.           
 cementation) (10).            matrix composites.   Mixtures thereof    
                                                     (4).               

[[Page 12972]]
                                                                        
                              Titanium alloys (13)  Silicides.          
                                                    Aluminides.         
                                                    Alloyed aluminides  
                                                     (2).               
                              Refractory metals                         
                               and alloys (8).                          
D. Plasma spraying..........  Superalloys.........  MCrAlx (5).         
                                                    Modified zirconia   
                                                     (12).              
                                                    Mixtures thereof    
                                                     (4).               
                                                    Abradable.          
                                                    Nickel-Graphite.    
                                                    Abradable.          
                                                    Ni-Cr-Al-.          
                                                    Bentonite.          
                                                    Abradable.          
                                                    Al-Si-Polyester.    
                                                    Alloyed aluminides  
                                                     (2).               
                              Aluminum alloys (6).  MCrAlx (5).         
                                                    Modified zirconia   
                                                     (12).              
                                                    Silicides.          
                                                    Mixtures thereof    
                                                     (4).               
                              Refractory metals     Aluminides.         
                               and alloys (8).      Silicides.          
                                                    Carbides.           
                              Corrosion resistant   Modified zirconia   
                               steel (7).            (12).              
                                                    Mixtures thereof    
                                                     (4).               
                              Titanium alloys (13)  Carbides.           
                                                    Aluminides.         
                                                    Silicides.          
                                                    Alloyed aluminides  
                                                     (2).               
                                                    Abradable.          
                                                    Nickel-Graphite.    
                                                    Abradable.          
                                                    Ni-Cr-Al-.          
                                                    Bentonite.          
                                                    Abradable.          
                                                    Al-Si-Polyester.    
E. Slurry Deposition........  Refractory metals     Fused silicides.    
                               and alloys (8).      Fused aluminides    
                                                     except for         
                                                     resistance heating 
                                                     elements.          
                              Carbon-carbon,        Silicides.          
                               Ceramic and Metal    Carbides.           
                               matrix composites.   Mixtures thereof    
                                                     (4).               
F. Sputter Deposition.......  ``Superalloys''.....  Alloyed silicides.  
                                                    Alloyed aluminides  
                                                     (2).               
                                                    Noble metal modified
                                                     aluminides (3).    
                                                    MCrAlx (5).         
                                                    Modified zirconia   
                                                     (12).              
                                                    Platinum.           
                                                    Mixtures thereof    
                                                     (4).               
                              Ceramics and Low-     Silicides.          
                               expansion glasses    Platinum.           
                               (14).                Mixtures thereof.   
                                                     (4)                
                                                    Dielectric layers   
                                                     (15).              
                              Titanium alloys (13)  Borides.            
                                                    Nitrides.           
                                                    Oxides.             
                                                    Silicides.          
                                                    Aluminides.         
                                                    Alloyed aluminides  
                                                     (2).               
                                                    Carbides.           
                              Carbon-carbon,        Silicides.          
                               Ceramic and Metal    Carbides.           
                               matrix composites.   Refractory metals.  
                                                    Mixtures thereof    
                                                     (4).               
                                                    Dielectric layers   
                                                     (15).              
                              Cemented tungsten     Carbides.           
                               carbide (16),        Tungsten.           
                               Silicon carbide.     Mixtures thereof    
                                                     (4).               
                                                    Dielectric layers   
                                                     (15).              
                              Molybdenum and        Dielectric layers   
                               Molybdenum alloys.    (15).              
                              Beryllium and         Borides.            
                               Beryllium alloys.    Dielectric layers   
                                                     (15).              
                              Sensor window         Dielectric layers   
                               materials (9).        (15).              

[[Page 12973]]
                                                                        
                              Refractory metals     Aluminides.         
                               and alloys (8).      Silicides.          
                                                    Oxides.             
                                                    Carbides.           
G. Ion Implantation.........  High temperature      Additions of        
                               bearing steels.       Chromium, Tantalum,
                                                     or Niobium         
                                                     (Columbium).       
                              Titanium alloys (15)  Borides.            
                                                    Nitrides.           
                              Beryllium and         Borides.            
                               Beryllium alloys.                        
                              Cemented tungsten     Carbides.           
                               carbide (16).        Nitrides.           
------------------------------------------------------------------------



Notes to Table on Deposition Techniques

    1. The term ``coating process'' includes coating repair and 
refurbishing as well as original coating.
    2. The term ``alloyed aluminide'' coating includes single or 
multiple-step coatings in which an element or elements are deposited 
prior to or during application of the aluminide coating, even if 
these elements are deposited by another coating process. It does 
not, however, include the multiple use of single-step pack 
cementation processes to achieve alloyed aluminides.
    3. The term `noble metal modified aluminide' coating includes 
multiple-step coatings in which the noble metal or noble metals are 
laid down by some other coating process prior to application of the 
aluminide coating.
    4. Mixtures consist of infiltrated material, graded 
compositions, co-deposits and multilayer deposits and are obtained 
by one or more of the coating processes specified in the Table.
    5. MCrAlX refers to a coating alloy where M equals cobalt, iron, 
nickel or combinations thereof and X equals hafnium, yttrium, 
silicon, tantalum in any amount or other intentional additions over 
0.01 weight percent in various proportions and combinations, except:
    a. CoCrAlY coatings which contain less than 22 weight percent of 
chromium, less than 7 weight percent of aluminium and less than 2 
weight percent of yttrium;
    b. CoCrAlY coatings which contain 22 to 24 weight percent of 
chromium, 10 to 12 weight percent of aluminium and 0.5 to 0.7 weight 
percent of yttrium; or
    c. NiCrAlY coatings which contain 21 to 23 weight percent of 
chromium, 10 to 12 weight percent of aluminium and 0.9 to 1.1 weight 
percent of yttrium.
    6. The term ``aluminium alloys'' refers to alloys having an 
ultimate tensile strength of 190 MPa or more measured at 293 K 
(20 deg. C).
    7. The term `corrosion resistant steel' refers to AISI (American 
Iron and Steel Institute) 300 series or equivalent standard steels.
    8. Refractory metals consist of the following metals and their 
alloys: niobium (columbium), molybdenum, tungsten and tantalum.
    9. Sensor window materials, as follows: alumina, silicon, 
germanium, zinc sulphide, zinc selenide, gallium arsenide and the 
following metal halides: potassium iodide, potassium fluoride, or 
sensor window materials of more than 40 mm diameter for thallium 
bromide and thallium chlorobromide.
    10. ``Technology'' for single-step pack cementation of solid 
airfoils is not controlled by this Category.
    11. Polymers, as follows: polyimide, polyester, polysulfide, 
polycarbonates and polyurethanes.
    12. Modified zirconia refers to additions of other metal oxides, 
e.g., calcia, magnesia, yttria, hafnia, rare earth oxides, etc., to 
zirconia in order to stabilize certain crystallographic phases and 
phase compositions. Thermal barrier coatings made of zirconia, 
modified with calcia or magnesia by mixing or fusion, are not 
controlled.
    13. Titanium alloys refers to aerospace alloys having an 
ultimate tensile strength of 900 MPa or more measured at 293 K 
(20 deg. C).
    14. Low-expansion glasses refers to glasses which have a 
coefficient of thermal expansion of 1  x  10<SUP>-7 K<SUP>-1 or less 
measured at 293 K (20 deg. C).
    15. Dielectric layers are coatings constructed of multi-layers 
of insulator materials in which the interference properties of a 
design composed of materials of various refractive indices are used 
to reflect, transmit or absorb various wavelength bands. Dielectric 
layers refers to more than four dielectric layers or dielectric/
metal composite layers.
    16. Cemented tungsten carbide does not include cutting and 
forming tool materials consisting of tungsten carbide/(cobalt, 
nickel), titanium carbide/(cobalt, nickel), chromium carbide/nickel-
chromium and chromium arbide/nickel.

Technical Note to Table on Deposition Techniques

    Processes specified in Column 1 of the Table are defined as 
follows:
    a. Chemical Vapor Deposition (CVD) is an overlay coating or 
surface modification coating process wherein a metal, alloy, 
composite, dielectric or ceramic is deposited upon a heated 
substrate. Gaseous reactants are decomposed or combined in the 
vicinity of a substrate resulting in the deposition of the desired 
elemental, alloy or compound material on the substrate. Energy for 
this decomposition or chemical reaction process may be provided by 
the heat of the substrate, a glow discharge plasma, or ``laser'' 
irradiation.

    Note 1: CVD includes the following processes: directed gas flow 
out-of-pack deposition, pulsating CVD, controlled nucleation thermal 
decomposition (CNTD), plasma enhanced or plasma assisted CVD 
processes.
    Note 2: Pack denotes a substrate immersed in a powder mixture.
    Note 3: The gaseous reactants used in the out-of-pack process 
are produced using the same basic reactions and parameters as the 
pack cementation process, except that the substrate to be coated is 
not in contact with the powder mixture.

    b. Thermal Evaporation-Physical Vapor Deposition (TE-PVD) is an 
overlay coating process conducted in a vacuum with a pressure less 
than 0.1 Pa wherein a source of thermal energy is used to vaporize 
the coating material. This process results in the condensation, or 
deposition, of the evaporated species onto appropriately positioned 
substrates. The addition of gases to the vacuum chamber during the 
coating process to synthesize compound coatings is an ordinary 
modification of the process. The use of ion or electron beams, or 
plasma, to activate or assist the coating's deposition is also a 
common modification in this technique. The use of monitors to 
provide in-process measurement of optical characteristics and 
thickness of coatings can be a feature of these processes. Specific 
TE-PVD processes are as follows:
    1. Electron Beam PVD uses an electron beam to heat and evaporate 
the material which forms the coating;
    2. Resistive Heating PVD employs electrically resistive heating 
sources capable of producing a controlled and uniform flux of 
evaporated coating species;
    3. ``Laser'' Evaporation uses either pulsed or continuous wave 
``laser'' beams to heat the material which forms the coating;
    4. Cathodic Arc Deposition employs a consumable cathode of the 
material which forms the coating and has an arc discharge 
established on the surface by a momentary contact of a ground 
trigger. Controlled motion of arcing erodes the cathode surface 
creating a highly ionized plasma. The anode can be either a cone 
attached to the periphery of the cathode, through an insulator, or 
the chamber. Substrate biasing is used for non line-of-sight 
deposition.

    Note: This definition does not include random cathodic arc 
deposition with non-biased substrates.

    c. Ion Plating is a special modification of a general TE-PVD 
process in which a plasma

[[Page 12974]]
or an ion source is used to ionize the species to be deposited, and 
a negative bias is applied to the substrate in order to facilitate 
the extraction of the species to be deposited from the plasma. The 
introduction of reactive species, evaporation of solids within the 
process chamber, and the use of monitors to provide in-process 
measurement of optical characteristics and thicknesses of coatings 
are ordinary modifications of the process.
    d. Pack Cementation is a surface modification coating or overlay 
coating process wherein a substrate is immersed in a powder mixture 
(a pack), that consists of:
    1. The metallic powders that are to be deposited (usually 
aluminum, chromium, silicon or combinations thereof);
    2. An activator (normally a halide salt); and
    3. An inert powder, most frequently alumina. The substrate and 
powder mixture is contained within a retort which is heated to 
between 1,030 K (757 deg. C) to 1,375 K (1,102 deg. C) for 
sufficient time to deposit the coating.
    e. Plasma Spraying is an overlay coating process wherein a gun 
(spray torch) which produces and controls a plasma accepts powder or 
wire coating materials, melts them and propels them towards a 
substrate, whereon an integrally bonded coating is formed. Plasma 
spraying constitutes either low pressure plasma spraying or high 
velocity plasma spraying carried out underwater.

    Note 1: Low pressure means less than ambient atmospheric 
pressure.
    Note 2: High velocity refers to nozzle-exit gas velocity 
exceeding 750 m/s calculated at 293 K (20 deg. C) at 0.1 MPa.

    f. Slurry Deposition is a surface modification coating or 
overlay coating process wherein a metallic or ceramic powder with an 
organic binder is suspended in a liquid and is applied to a 
substrate by either spraying, dipping or painting, subsequent air or 
oven drying, and heat treatment to obtain the desired coating.
    g. Sputter Deposition is an overlay coating process based on a 
momentum transfer phenomenon, wherein positive ions are accelerated 
by an electric field towards the surface of a target (coating 
material). The kinetic energy of the impacting ions is sufficient to 
cause target surface atoms to be released and deposited on an 
appropriately positioned substrate.

    Note 1: The Table refers only to triode, magnetron or reactive 
sputter deposition which is used to increase adhesion of the coating 
and rate of deposition and to radio frequency (RF) augmented sputter 
deposition used to permit vaporization of non-metallic coating 
materials.
    Note 2: Low-energy ion beams (less than 5 keV) can be used to 
activate the deposition.

    h. Ion Implantation is a surface modification coating process in 
which the element to be alloyed is ionized, accelerated through a 
potential gradient and implanted into the surface region of the 
substrate. This includes processes in which ion implantation is 
performed simultaneously with electron beam physical vapor 
deposition or sputter deposition.

Accompanying Technical Information to Table on Deposition Techniques

    1. ``Technology'' for pretreatments of the substrates listed in 
the Table, as follows:
    a. Chemical stripping and cleaning bath cycle parameters, as 
follows:
    1. Bath composition;
    a. For the removal of old or defective coating corrosion product 
or foreign deposits;
    b. For preparation of virgin substrates;
    2. Time in bath;
    3. Temperature of bath;
    4. Number and sequences of wash cycles;
    b. Visual and macroscopic criteria for acceptance of the cleaned 
part;
    c. Heat treatment cycle parameters, as follows:
    1. Atmosphere parameters, as follows:
    a. Composition of the atmosphere;
    b. Pressure of the atmosphere;
    2. Temperature for heat treatment;
    3. Time of heat treatment;
    d. Substrate surface preparation parameters, as follows:
    1. Grit blasting parameters, as follows:
    a. Grit composition;
    b. Grit size and shape;
    c. Grit velocity;
    2. Time and sequence of cleaning cycle after grit blast;
    3. Surface finish parameters;
    e. Masking technique parameters, as follows:
    1. Material of mask;
    2. Location of mask;
    2. ``Technology'' for in situ quality assurance techniques for 
evaluation of the coating processes listed in the Table, as follows:
    a. Atmosphere parameters, as follows:
    1. Composition of the atmosphere;
    2. Pressure of the atmosphere;
    b. Time parameters;
    c. Temperature parameters;
    d. Thickness parameters;
    e. Index of refraction parameters;
    3. ``Technology'' for post deposition treatments of the coated 
substrates listed in the Table, as follows:
    a. Shot peening parameters, as follows:
    1. Shot composition;
    2. Shot size;
    3. Shot velocity;
    b. Post shot peening cleaning parameters;
    c. Heat treatment cycle parameters, as follows:
    1. Atmosphere parameters, as follows:
    a. Composition of the atmosphere;
    b. Pressure of the atmosphere;
    2. Time-temperature cycles;
    d. Post heat treatment visual and macroscopic criteria for 
acceptance of the coated substrates;
    4. ``Technology'' for quality assurance techniques for the 
evaluation of the coated substrates listed in the Table, as follows:
    a. Statistical sampling criteria;
    b. Microscopic criteria for:
    1. Magnification;
    2. Coating thickness uniformity;
    3. Coating integrity;
    4. Coating composition;
    5. Coating and substrates bonding;
    6. Microstructural uniformity.
    c. Criteria for optical properties assessment:
    1. Reflectance;
    2. Transmission;
    3. Absorption;
    4. Scatter;
    5. ``Technology'' and parameters related to specific coating and 
surface modification processes listed in the Table, as follows:
    a. For Chemical Vapor Deposition:
    1. Coating source composition and formulation;
    2. Carrier gas composition;
    3. Substrate temperature;
    4. Time-temperature-pressure cycles;
    5. Gas control and part manipulation;
    b. For Thermal Evaporation--Physical Vapor Deposition:
    1. Ingot or coating material source composition;
    2. Substrate temperature;
    3. Reactive gas composition;
    4. Ingot feed rate or material vaporization rate;
    5. Time-temperature-pressure cycles;
    6. Beam and part manipulation;
    7. ``Laser'' parameters, as follows:
    a. Wave length;
    b. Power density;
    c. Pulse length;
    d. Repetition ratio;
    e. Source;
    f. Substrate orientation;
    c. For Pack Cementation:
    1. Pack composition and formulation;
    2. Carrier gas composition;
    3. Time-temperature-pressure cycles;
    d. For Plasma Spraying:
    1. Powder composition, preparation and size distributions;
    2. Feed gas composition and parameters;
    3. Substrate temperature;
    4. Gun power parameters;
    5. Spray distance;
    6. Spray angle;
    7. Cover gas composition, pressure and flow rates;
    8. Gun control and part manipulation;
    e. For Sputter Deposition:
    1. Target composition and fabrication;
    2. Geometrical positioning of part and target;
    3. Reactive gas composition;
    4. Electrical bias;
    5. Time-temperature-pressure cycles;
    6. Triode power;
    7. Part manipulation;
    f. For Ion Implantation:
    1. Beam control and part manipulation;
    2. Ion source design details;
    3. Control techniques for ion beam and deposition rate 
parameters;
    4. Time-temperature-pressure cycles.
    g. For Ion Plating:
    1. Beam control and part manipulation;
    2. Ion source design details;
    3. Control techniques for ion beam and deposition rate 
parameters;
    4. Time-temperature-pressure cycles;
    5. Coating material feed rate and vaporization rate;
    6. Substrate temperature;
    7. Substrate bias parameters.


2E018  ``Technology'' for the ``use'' of equipment controlled by 2B018.

License Requirements

    Reason for Control: NS, MT, AT

[[Page 12975]]


------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NS applies to entire entry.............  NS Column 1.                   
MT applies to ``technology'' for         MT Column 1.                   
 equipment controlled by 2B018 for MT                                   
 reasons.                                                               
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    CIV: N/A
    TSR: Yes

List of Items Controlled

    Unit: N/A
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2E101  ``Technology'' according to the General Technology Note for the 
``use'' of items or ``software'' controlled by 2B004, 2B104, 2B115, 
2B116 or 2D101.

License Requirements

    Reason for Control: MT, NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
MT applies to entire entry.............  MT Column 1.                   
NP applies to 2B004 and 2B104.a........  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions


    CIV: N/A
    TSR: N/A

List of Items Controlled

    Unit: N/A
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2E201  ``Technology'' according to the General Technology Note for the 
``use'' of items or ``software'' controlled by 2A225, 2A226, 2B001, 
2B006, 2B007, 2B204, 2B207, 2B215, 2B225 to 2B232 or 2D201 for NP 
reasons.

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions


    CIV: N/A
    TSR: N/A

List of Items Controlled

    Unit: N/A
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2E290  ``Technology'' according to the General Technology Note for the 
``use'' of items controlled by 2A290, 2A291, 2A292, 2A293, 2A294, 29295 
and 2B290.

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to ``technology'' for         NP Column 1.                   
 equipment controlled by 2A291 to 2A295                                 
 or 2B290.                                                              
NP applies to ``technology'' for         NP Column 2.                   
 equipment controlled by 2A290.                                         
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions


    CIV: N/A
    TSR: N/A

List of Items Controlled

    Unit: N/A
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2E301  ``Technology'' for ``use'' of items controlled by 2B350, 2B351 
and 2B352.

License Requirements

    Reason for Control: CB, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
CB applies to entire entry.............  CB Column 3.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions


    CIV: N/A
    TSR: N/A

List of Items Controlled

    Unit: N/A
    Related Controls: N/A
    Related Definitions: N/A
    Items: The lists of items controlled are contained in the ECCN 
headings.


2E993  ``Technology'' for the ``use'' of equipment controlled by 2B991, 
2B992, 2B993, or 2B994.

License Requirements

    Reason for Control: AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions


    CIV: N/A
    TSR: N/A

List of Items Controlled

    Unit: N/A
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


2E994  ``Technology'' for the ``use'' of portable electric generators 
controlled by 2A994.

License Requirements

    Reason for Control: AT
    Control(s): AT applies to entire entry. A license is required 
for items controlled by this entry to Cuba, Iran, Libya, and North 
Korea. The Commerce Country Chart is not designed to determine 
licensing requirements for this entry. See part 746 of the EAR for 
additional information.

    Note: Exports from the U.S. and transshipments to Iran must be 
licensed by the Department of Treasury, Office of Foreign Assets 
Control. (See Sec. 742.8 and Sec. 746.7 of the EAR for additional 
information on this requirement.)

License Exceptions


    CIV: N/A
    TSR: N/A

List of Items Controlled

    Unit: N/A
    Related Controls: N/A
    Related Definitions: N/A
    Items: The list of items controlled is contained in the ECCN 
heading.


EAR99  Items subject to the EAR that are not elsewhere specified in 
this CCL Category or in any other category in the CCL are designated by 
the number EAR99.

Advisory Notes for Category 2

    Advisory Note 1: Licenses are likely to be approved, as 
administrative exceptions, to satisfactory end-users in the People's 
Republic of China of machine tools for milling controlled by 
2B001.c.1 to civil end-users other than nuclear and aerospace, 
provided that they are not controlled by 2B001.c.1.b.1, c.1.b.4, 
c.1.b.5, or c.1.b.6.

    Advisory Note 2: Licenses are likely to be approved, as 
administrative exceptions, to satisfactory end-users in Country 
Group D:1 of equipment controlled by 2B006.b.1 to civil end-users 
not engaged in aerospace or nuclear activities.

Category 3--Electronics Design, Development and Production

A. Equipment, Assemblies and Components

    Note 1: The control status of equipment, devices and components 
described in Category 3A, other than those described in 3A001.a.3 to 
a.10, or 3A001.a.12, that are specially designed for or that have 
the same functional characteristics as other equipment are 
determined by the control status of the other equipment.
    Note 2: The control status of integrated circuits described in 
3A001.a.3 to a.9 or 3A001.a.12 that are unalterably programmed or 
designed for a specific function for other equipment is determined 
by the control status of the other equipment.

    N.B.: When the manufacturer or applicant cannot determine the 
control status of the other equipment, the control status of the 
integrated circuits is determined in 3A001.a.3 to a.9 or 3A001.a.12. 
If the

[[Page 12976]]
integrated circuit is a silicon-based ``microcomputer microcircuit'' 
or a microcontroller microcircuit described in 3A001.a.3 having an 
operand (data) word length of 8 bits or less, the control status of 
the integrated circuit is determined in 3A001.a.3.


3A001  Electronic devices and components.

License Requirements

    Reason for Control: NS, MT, NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NS applies to entire entry.............  NS Column 2.                   
MT applies to 3A001.a.1.a..............  MT Column 1.                   
NP applies to 3A001.e.5................  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: $1500: 3A001.c; $3000: 3A001.b.1, b.2, b.3, .d, .e and .f; 
$5000: 3A001.a, and .b.4 to b.7
    GBS: Yes, except 3A001.a.1, b.1, b.3 to b.7, c to f
    CIV: Yes, except 3A001.a.1, a.2, a.5, a.6, a.9, a.10, and a.12, 
.b, .c, .d, .e, and .f

List of Items Controlled

    Unit: Number
    Related Controls: N/A
    Related Definitions: N/A
    Items: a. General purpose integrated circuits, as follows:

    Notes: 1. The control status of wafers (finished or unfinished), 
in which the function has been determined, is to be evaluated 
against the parameters of 3A001.a.

    2. Integrated circuits include the following types:
    ``Monolithic integrated circuits'';
    ``Hybrid integrated circuits'';
    ``Multichip integrated circuits'';
    ``Film type integrated circuits'', including silicon-on-sapphire 
integrated circuits;
    ``Optical integrated circuits''.
    a.1. Integrated circuits, designed or rated as radiation 
hardened to withstand either of the following:
    a.1.a. A total dose of 5 x 10\5\ Rads (Si), or higher; or
    a.1.b. A dose rate upset of 5 x 10\8\ Rads (Si)/s or higher;
    a.2. Integrated circuits described in 3A00l.a.3 to a.10 or 
3A00l.a.12, as follow:
    a.2.a. Rated for operation at an ambient temperature above 398 K 
(+125 deg. C);
    a.2.b. Rated for operation at an ambient temperature below 218 K 
(-55 deg. C); or
    a.2.c. Rated for operation over the entire ambient temperature 
range from 218 K (-55 deg. C) to 398 K (+125 deg. C);

    Note: 3A00l.a.2 does not apply to integrated circuits for civil 
automobile or railway train applications.

    a.3. ``Microprocessor microcircuits'', ``microcomputer 
microcircuits'' and microcontroller microcircuits, having any of the 
following:

    Note: 3A00l.a.3 includes digital signal processors, digital 
array processors and digital coprocessors.

    a.3.a An arithmetic logic unit with an access width of 32 bit or 
more and a ``composite theoretical performance'' (``CTP'') of 80 
million theoretical operations per second (Mtops) or more;
    a.3.b. Manufactured from a compound semiconductor and operating 
a clock frequency exceeding 40 MHz; or
    a.3.c. More than one data or instruction bus or serial 
communication port for external interconnection in a parallel 
processor with a transfer rate exceeding 2.5 Mbyte/s;
    a.4. Electrically erasable programmable read-only memories 
(EEPROMs), static random-access memories (SRAMs), and storage 
integrated circuits manufactured from a compound semiconductor, as 
follows:
    a.4.a. Electrically erasable programmable read-only memories 
(EEPROMs) with a storage capacity:
    a.4.a.1. Exceeding 16 Mbit per package for flash memory types; 
or
    a.4.a.2. Exceeding either of the following limits for all other 
EEPROM types:
    a.4.a.2.a. 4 Mbit per package; or
    a.4.a.2.b. 1 Mbit per package and having a maximum access time 
of less than 80 ns;
    a.4.b. Static random-access memories (SRAMs) with a storage 
capacity:
    a.4.b.1. Exceeding 4 Mbit per package; or
    b.4.b.2. Exceeding 1 Mbit per package and having a maximum 
access time of less than 20 ns;
    a.4.c. Storage integrated circuits manufactured from a compound 
semiconductor;
    a.5. Analog-to-digital and digital-to-analog converter 
integrated circuits, as follows:
    a.5.a. Analog-to-digital converters having any of the following:
    a.5.a.1. A resolution of 8 bits or more, but less than 12 bits, 
with a total conversion time to maximum resolution of less than 10 
ns;
    a.5.a.2. A resolution of 12 bits with a total conversion time to 
maximum resolution of less than 200 ns; or
    a.5.a.3. A resolution of more than 12 bits with a total 
conversion time to maximum resolution of less than 2 microseconds;
    a.5.b. Digital-to-analog converters with a resolution of 12 bits 
or more, and a ``settling time'' of less than 10 ns;
    a.6. Electro-optical or ``optical integrated circuits'' for 
``signal processing'' having all of the following:
    a.6.a. One or more internal ``laser'' diodes;
    a.6.b. One or more internal light detecting elements; and
    a.6.c. Optical waveguides;
    a.7. Field programmable gate arrays having either of the 
following:
    a.7.a. An equivalent usable gate count of more than 30,000 (2 
input gates); or
    a.7.b. A typical ``basic gate propagation delay time'' of less 
than 0.4 ns;
    a.8. Field programmable logic arrays having either of the 
following:
    a.8.a. An equivalent usable gate count of more than 30,000 (2 
input gates); or
    b. A toggle frequency exceeding 133 MHz;
    a.9. Neural network integrated circuits;
    a.10. Custom integrated circuits for which either the function 
is unknown, or the control status of the equipment in which the 
integrated circuits will be used is unknown to the manufacturer, 
having any of the following:
    a.10.a. More than 144 terminals;
    a.10.b. A typical ``basic gate propagation delay time'' of less 
than 0.4 ns; or
    a.10.c. An operating frequency exceeding 3 GHz;
    a.11. Digital integrated circuits, other than those described in 
3A001.a.3 to a.l0 or 3A001.a.12, based upon any compound 
semiconductor and having either of the following:
    a.11.a. An equivalent gate count of more than 300 (2 input 
gates); or
    a.11.b. A toggle frequency exceeding 1.2 GHz;
    a.12. Fast Fourier Transform (FFT) processors having any of the 
following characteristics:
    a.12.a. A rated execution time for a 1,024 point complex FFT of 
less than 1 ms;
    a.12.b. A rated execution time for an N-point complex FFT of 
other than 1,024 points of less than N log<INF>2 N/10,240 ms, where 
N is the number of points; or
    a.12.c. A butterfly throughput of more than 5.12 MHz;
    b. Microwave or millimeter wave devices:
    b.1. Electronic vacuum tubes and cathodes, as follows:
    (Frequency agile magnetron tubes are subject to the export 
licensing authority of the U.S. Department of State, Office of 
Defense Trade Controls. See 22 CFR part 121, Category XI.)

    Note: 3A001.b.1 does not control tubes designed or rated to 
operate in the Standard Civil Telecommunications Bands at 
frequencies not exceeding 31 GHz.

    b.1.a. Traveling wave tubes, pulsed or continuous wave, as 
follows:
    b.1.a.1 Operating at frequencies higher than 31 GHz;
    b.1.a.2. Having a cathode heater element with a turn on time to 
rated RF power of less than 3 seconds;
    b.1.a.3. Coupled cavity tubes, or derivatives thereof, with an 
``instantaneous bandwidth'' of more than 7% or a peak power 
exceeding 2.5 kW;
    b.1.a.4. Helix tubes, or derivatives thereof, with any of the 
following characteristics:
    b.1.a.4.a. An ``instantaneous bandwidth'' of more than one 
octave, and average power (expressed in kW) times frequency 
(expressed in GHz) of more than 0.5;
    b.1.a.4.b. An ``instantaneous bandwidth'' of one octave or less, 
and average power (expressed in kW) times frequency (expressed in 
GHz) of more than 1; or
    b.1.a.4.c. ``Space qualified'';
    b.1.b. Crossed-field amplifier tubes with a gain of more than 17 
dB;
    b.1.c. Impregnated cathodes for electronic tubes, with either of 
the following:
    b.1.c.1. Having a turn on time to rated emission of less than 3 
seconds; or
    b.1.c.2. Producing a continuous emission current density at 
rated operating conditions exceeding 5 A/cm<SUP>2;
    b.2. Microwave integrated circuits or modules containing 
``monolithic integrated circuits'' operating at frequencies 
exceeding 3 GHz;

    Note: 3A001.b.2 does not control circuits or modules for 
equipment designed or rated to operate in the Standard Civil

[[Page 12977]]
Telecommunications Bands at frequencies not exceeding 31 GHz.

    b.3. Microwave transistors rated for operation at frequencies 
exceeding 31 GHz;
    b.4. Microwave solid state amplifiers, as follows:
    b.4.a. Operating at frequencies exceeding 10.5 GHz and having an 
``instantaneous bandwidth'' of more than half an octave; or
    b.4.b. Operating at frequencies exceeding 31 GHz;
    b.5. Electronically or magnetically tunable band-pass or band-
stop filters having more than 5 tunable resonators capable of tuning 
across a 1.5:1 frequency band (f<INF>max/f<INF>min) in less than 10 
microseconds with either:
    b.5.a. A band-pass bandwidth of more than 0.5 % of center 
frequency; or
    b.5.b. A band-stop bandwidth of less than 0.5 percent of center 
frequency;
    b.6. Microwave assemblies capable of operating at frequencies 
exceeding 31 GHz;
    b.7. Mixers and converters designed to extend the frequency 
range of equipment described in 3A002.c, 3A002.e or 3A002.f beyond 
the control limits stated therein;
    c. Acoustic wave devices, as follows, and specially designed 
components therefor:
    c.1. Surface acoustic wave and surface skimming (shallow bulk) 
acoustic wave devices (i.e., ``signal processing'' devices employing 
elastic waves in materials), having any of the following:
    c.1.a. A carrier frequency exceeding 2.5 GHz;
    c.1.b. A carrier frequency 2.5 GHz or less, and:
    c.1.b.1. A frequency side-lobe rejection exceeding 55 dB;
    c.1.b.2. A product of the maximum delay time and the bandwidth 
(time in microseconds and bandwidth in MHz) of more than 100; or
    c.1.b.3. A dispersive delay of more than 10 microseconds; or
    c.1.c. A carrier frequency exceeding 1 GHz and a bandwidth of 
250 MHz or more;
    c.2. Bulk (volume) acoustic wave devices (i.e., ``signal 
processing'' devices employing elastic waves) that permit the direct 
processing of signals at frequencies exceeding 1 GHz;
    c.3. Acoustic-optic ``signal processing'' devices employing 
interaction between acoustic waves (bulk wave or surface wave) and 
light waves that permit the direct processing of signals or images, 
including spectral analysis, correlation or convolution;
    d. Electronic devices or circuits containing components, 
manufactured from ``superconductive'' materials specially designed 
for operation at temperatures below the ``critical temperature'' of 
at least one of the ``superconductive'' constituents, with any of 
the following:
    d.1. Electromagnetic amplification:
    d.1.a. At frequencies equal to or less than 31 GHz with a noise 
figure of less than 0.5 dB; or
    d.1.b. At frequencies exceeding 31 GHz;
    d.2. Current switching for digital circuits using 
``superconductive'' gates with a product of delay time per gate (in 
seconds) and power dissipation per gate (in watts) of less than 
10<SUP>-14 J; or
    d.3. Frequency selection at all frequencies using resonant 
circuits with Q-values exceeding 10,000;
    e. High energy devices, as follows:
    e.1. Batteries, as follows:

    Note: 3A001.e.1 does not control batteries with volumes equal to 
or less than 27 cm<SUP>3 (e.g., standard C-cells or R 14 batteries).

    e.1.a. Primary cells and batteries having an energy density 
exceeding 480 Wh/kg and rated for operation in the temperature range 
from below 243 K (-30 deg. C) to above 343 K (70 deg. C);
    e.1.b. Rechargeable cells and batteries having an energy density 
exceeding 150 Wh/kg after 75 charge/discharge cycles at a discharge 
current equal to C/5 hours (C being the nominal capacity in ampere 
hours) when operating in the temperature range from below 253 K 
(-20 deg. C) to above 333 K (60 deg. C);

    Technical Note: Energy density is obtained by multiplying the 
average power in watts (average voltage in volts times average 
current in amperes) by the duration of the discharge in hours to 75% 
of the open circuit voltage divided by the total mass of the cell 
(or battery) in kg.

    e.1.c. ``Space qualified'' and radiation hardened photovoltaic 
arrays with a specific power exceeding 160 W/m<SUP>2 at an operating 
temperature of 301 K (28 deg. C) under a tungsten illumination of 1 
kW/m<SUP>2 at 2,800 K (2,527 deg. C);
    e.2. High energy storage capacitors, as follows:
    e.2.a. Capacitors with a repetition rate of less than 10 Hz 
(single shot capacitors) having all of the following:
    e.2.a.1. A voltage rating equal, to or more than 5 kV;
    e.2.a.2. An energy density equal to or more than 250 J/kg; and
    e.2.a.3. A total energy equal to or more than 25 kJ;
    e.2.b. Capacitors with a repetition rate of 10 Hz or more 
(repetition rated capacitors) having all of the following:
    e.2.b.1. A voltage rating equal to or more than 5 kv;
    e.2.b.2. An energy density equal to or more than 50 J/kg;
    e.2.b.3. A total energy equal to or more than 100 J; and
    e.2.b.4. A charge/discharge cycle life equal to or more than 
10,000;
    e.3. ``Superconductive'' electromagnets or solenoids specially 
designed to be fully charged or discharged in less than one second, 
having all of the following:
    e.3.a. Energy delivered during the discharge exceeding 10 kJ in 
the first second;
    e.3.b. Inner diameter of the current carrying windings of more 
than 250 mm; and
    e.3.c. Rated for a magnetic induction of more than 8 T or 
``overall current density'' in the winding of more than 300 A/
mm<SUP>2;

    Note: 3A001.e.3. does not control ``superconductive'' 
electromagnets or solenoids specially designed for Magnetic 
Resonance Imaging (MRI) medical equipment.

    e.4. Circuits or systems for electromagnetic energy storage, 
containing components manufactured from ``superconductive'' 
materials specially designed for operation at temperatures below the 
``critical temperature of at least one of their ``superconductive'' 
constituents, having all of the following:
    e.4.a. Resonant operating frequencies exceeding 1 MHz;
    e.4.b. A stored energy density of 1 MJ/m <SUP>3 or more; and
    3.4.c. A discharge time of less than 1 ms; e.5. Flash discharge 
type X-ray systems, and tubes therefor, having all of the following:
    e.5.a. A peak power exceeding 500 MW;
    e.5.b. An output voltage exceeding 500 kV; and
    e.5.c. A pulse width of less than 0.2 microsecond;
    f. Rotary input type shaft absolute position encoders having 
either of the following:
    f.1. A resolution of better than 1 part in 265,000 (18 bit 
resolution) of full scale; or
    f.2. An accuracy better than <plus-minus> 2.5 seconds of arc.


3A002  General purpose electronic equipment.

License Requirements

    Reason for Control: NS, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NS applies to entire entry.............  NS Column 2.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: $3000: 3A002.a, .e, .f, .g; $5000: 3A002.b to d, and 
3A002.h
    GBS: Yes for 3A002.a.1. 3A002.h and a.2, .b, d.2, as described 
in Advisory Note 1 to Category 3
    CIV: Yes for 3A002.h, and a.1, a.2, .b, d.2, as described in 
Advisory Note 1 to Category 3

List of Items Controlled

    Unit: Number
    Related Controls: N/A
    Related Definitions: N/A
    Items:

    a. Recording equipment, as follows, and specially designed test 
tape therefor:
    a.1. Analog instrumentation magnetic tape recorders, including 
those permitting the recording of digital signals (e.g., using a 
high density digital recording (HDDR) module), having any of the 
following:
    a.1.a. A bandwidth exceeding 4 MHz per electronic channel or 
track;
    a.1.b. A bandwidth exceeding 2 MHz per electronic channel or 
track and having more than 42 tracks; or
    a.1.c. A time displacement (base) error, measured in accordance 
with applicable Inter Range Instrumentation Group (IRIG) or 
Electronic Industries Association (EIA) documents, of less than #0.1 
microsecond;
    a.2. Digital video magnetic tape recorders having a maximum 
digital interface transfer rate exceeding 180 Mbit/s, except those 
specially designed for television recording using a signal format as 
standardized or recommended by the International Radio Consultative 
Committee (CCIR) or the International Technical Commission (IEC) for 
civil television applications;

[[Page 12978]]

    a.3. Digital instrumentation magnetic tape data recorders 
employing helical scan techniques or fixed head techniques, having 
either of the following characteristics:
    a.3.a. A maximum digital interface transfer rate exceeding 175 
Mbits/s; or
    a.3. b. ``Space qualified'';

    Note: 3A002.a.3 does not control analog magnetic tape recorders 
equipped with HDDR conversion electronics and configured to record 
only digital data.

    a.4. Equipment, with a maximum digital interface transfer rate 
exceeding 175 Mbit/s, designed to convert digital video magnetic 
tape recorders for use as digital instrumentation data recorders;
    a.5. Waveform digitizers and transient recorders with both of 
the following characteristics:
    a.5.a. Digitizing rates equal to or more than 200 million 
samples per second and a resolution of 10 bits or more; and
    a.5.b. A continuous throughput of 2 Gbits/s or more;

    Technical Note: For those instruments with a parallel bus 
architecture, the continuous throughput rates the highest word rate 
multiplied by the number of bits in a word. Continuous throughput is 
the fastest data rate the instrument can output to mass storage 
without the loss of any information while sustaining the sampling 
rate and analog-to-digital conversion.

    b. ``Frequency synthesizer'' ``electronic assemblies'' having a 
``frequency switching time'' from one selected frequency to another 
of less than 1 ms;
    c. ``Signal analyzers'', as follows:
    c.1. Capable of analyzing frequencies exceeding 31 GHz;
    c.2. ``Dynamic signal analyzers'' with a ``real-time bandwidth'' 
exceeding 25.6 kHz, except those using only constant percentage 
bandwidth filters (also known as octave or fractional octave 
filters);
    d. Frequency synthesized signal generators producing output 
frequencies, the accuracy and short term and long term stability of 
which are controlled, derived from or disciplined by the internal 
master frequency, and having any of the following:
    d.1. A maximum synthesized frequency exceeding 31 GHz;
    d.2. A ``frequency switching time'' from one selected frequency 
to another of less than 1 ms; or
    d.3. A single sideband (SSB) phase noise better than 
-(126+20log<INF>10F-20 log<INF>10f) in dBc/Hz, where F is the off-
set from the operating frequency in Hz and f is the operating 
frequency in MHz;

    Note: 3A002.d does not control equipment in which the output 
frequency is either produced by the addition or subtraction of two 
or more crystal oscillator frequencies, or by an addition or 
subtraction followed by a multiplication of the result.

    e. Network analyzers with a maximum operating frequency 
exceeding 31 GHz;

    Note: 3A002.e does not control ``swept frequency network 
analyzers'' with a maximum operating frequency not exceeding 40 GHz 
and that do not contain a data bus for remote control interfacing.

    f. Microwave test receivers with both of the following:
    f.1. A maximum operating frequency exceeding 31 GHz; and
    f.2. Capable of measuring amplitude and phase simultaneously;
    g. Atomic frequency standards having either of the following 
characteristics:
    g.1. Long term stability (aging) less (better) than 1 x 10 
<SUP>-11/month; or
    g.2. ``Space qualified'';

    Note: 3A002.g.1 does not control non-``space qualified'' 
rubidium standards.

    h. Emulators for microcircuits controlled by 3A001.a.3 or 
3A001.a.9.

    Note: 3A002.h does not control emulators designed for a 
``family'' that contains at least one device not controlled by 
3A001.a.3 or 3A001.a.9.


3A101  Electronic equipment, devices and components, other than those 
specified in 3A001.

License Requirements

    Reason for Control: MT, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
MT applies to entire entry.............  MT Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: $5,000
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: Number
    Related Controls: The corresponding EU list number controls 
analog-to-digital converters, usable in ``missiles'', designed to 
meet military specifications for ruggedized equipment in 1A101.a. 
These items are not controlled by this CCL entry. These items are 
subject to the export licensing authority of the U.S. Departement of 
State, Office of Defense Trade Controls (See 22 CFR 121.16, Item 
14--Category II).
    Related Definitions: N/A
    Items:

    a. Reserved.
    b. Accelerators capable of delivering electromagnetic radiation 
produced by bremsstrahlung from accelerated electrons of 2Mev or 
greater, and systems containing those accelerators, excluding that 
equipment specially designed for medical purposes.


3A201  Electronic components, other than those specified in 3A001.

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: Number
    Related Controls:
    Related Definition: This entry does not control magnets that are 
specially designed for and exported as parts of medical nuclear 
magnetic resonance (NMR) imaging systems. Such parts may be exported 
in separate shipments from different sources, provided that the 
related export control documents clearly specify that the parts are 
for medical NMR imaging systems that are being exported.
    Items:

    a. Capacitors with the following characteristics:
    a.1. Voltage rating greater than 1.4 kV, energy storage greater 
than 10J, capacitance greater than 500 nF and series inductance less 
than 50 nH; or
    a.2. Voltage rating greater than 750 V, capacitance greater than 
250 nF and series inductance less than 10 nH;
    b. Superconducting solenoidal electromagnets with all of the 
following characteristics:
    b.1. Capable of creating magnetic fields of more than 2 teslas 
(20 kilogauss);
    b.2. With an L/D ratio (length divided by inner diameter) 
greater than 2;
    b.3. With an inner diameter of more than 300 mm; and
    b.4. With a magnetic field uniform to better than 1% over the 
central 50% of the inner volume;
    c. Flash X-ray generators or pulsed electron accelerators with 
peak energy of 500 keV or greater, as follows; except: Accelerators 
that are component parts of devices designed for purposes other than 
electron beam or X-ray radiation (electron microscopy, for example) 
and those designed for medical purposes:
    c.1. Having an accelerator peak electron energy of 500 keV or 
greater but less than 25 MeV and with a figure of merit (K) of 0.25 
or greater, where K is defined as: K=1.7 x 10<SUP>3V<SUP>2.65Q, 
where V is the peak electron energy in million electron volts and Q 
is the total accelerated charge in coulombs if the accelerator beam 
pulse duration is less than or equal to 1 microsecond; if the 
accelerator beam pulse duration is greater than 1 microsecond, Q is 
the maximum accelerated charge in 1 microsecond [Q equals the 
integral of i with respect to t, over the lesser of 1 microsecond or 
the time duration of the beam pulse (Q=[integral] idt), where i is 
beam current in amperes and t is time in seconds]; or
    c.2. Having an accelerator peak electron energy of 25 MeV or 
greater and a peak power greater than 50 MW. [Peak power=(peak 
potential in volts) x (peak beam current in amperes)].

    Technical Notes: a. Time duration of the beam pulse - In 
machines, based on microwave accelerating cavities, the time 
duration of the beam pulse is the lesser of 1 microsecond or the 
duration of the bunched beam packet resulting from one microwave 
modulator pulse.

    b. Peak beam current--In machines based on microwave 
accelerating cavities, the peak beam current is the average current 
in the time duration of a bunched beam packet.

[[Page 12979]]



3A202  Oscilloscopes and transient recorders other than those 
controlled by 3A002.a.5, and specially designed components therefor.

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: Number
    Related Controls: N/A
    Related Definitions: Specially designed components specified in 
this item are the following, for analog oscilloscopes:
    1. Plug-in units;
    2. External amplifiers;
    3. pre-amplifiers;
    4. Sampling devices;
    5. Cathode ray tubes.
    Items:

    a. Non-modular analog oscilloscopes having a bandwidth of 1 GHz 
or greater;

    Technical Note: ``Bandwidth'' is defined as the band of 
frequencies over which the deflection on the cathode ray tube does 
not fall below 70.7% of that at the maximum point measured with a 
constant input voltage to the oscilloscope amplifier.

    b. Modular analog oscilloscope systems having either of the 
following characteristics:
    b.1. A mainframe with a bandwidth of 1 GHz or greater; or
    b.2. Plug-in modules with an individual bandwidth of 4 GHz or 
greater;
    c. Analog sampling oscilloscopes for the analysis of recurring 
phenomena with an effective bandwidth greater than 4 GHz;
    d. Digital oscilloscopes and transient recorders using analog-
to-digital conversion techniques, capable of storing transients by 
sequentially sampling one-shot input signals at successive intervals 
of less than 1 ns (greater than 1 giga-sample per second), 
digitizing to 8 bits or greater resolution, and storing 256 or more 
samples.


3A225  Frequency changers (also known as converters or inverters) or 
generators, having all of the following characteristics.

License Requirements

    Reason for Control: NP, AT

------------------------------------------------------------------------
               Control(s)                         Country Chart         
------------------------------------------------------------------------
NP applies to entire entry.............  NP Column 1.                   
AT applies to entire entry.............  AT Column 1.                   
------------------------------------------------------------------------

License Exceptions

    LVS: N/A
    GBS: N/A
    CIV: N/A

List of Items Controlled

    Unit: Number
    Related Controls: Frequency changers (also known as converters 
or inverters) especially designed or prepared to supply motor 
stators and having the characteristics described in 3A225.b and .d, 
together with a total harmonic distortion of less than 2 percent and 
an efficiency of greater than 80 percent are subject to the export 
licensing authority of the Nuclear Regulatory Commission. (See 10 
CFR part 110.)
    Related Definition: Motor stators are especially designed or 
prepared ring-shaped stators for high-speed multiphase AC hysteresis 
(or reluctance) motors for synchronous operation within a vacuum in 
the frequency range of 600 Hz to 2,000 Hz, and a power range of 50