Annex E. International Armaments Strategy
Army Science and Technology Master Plan (ASTMP 1997)

1. IR Focal Plane Array Fabrication and Packaging (France)

Description: New developments in Focal Plane Array (FPA) technology may provide significant enhancements over currently fielded systems. Of particular interest is the design, fabrication, and packaging of smart FPAs into a single (monolithic) structure. France is a world leader in several aspects of IR technologies, and has both the experience and supporting infrastructure necessary for research and development in this field.

A major barrier in implementing the monolithic structure of a smart FPA is the growth of Cadmium Zinc Telluride (CdZnTe) and Mercury Cadmium Telluride (HgCdTe) on Silicon (Si). Currently, a French Scientist is at Fort Belvoir working with ARL and NVESD scientists to overcome this obstacle.

Justification: The purpose of the Smart Focal Plane Arrays ASTMP STO is the development of a new generation of high density, two-dimension arrays to meet target acquisition requirements of future weapon systems. These arrays will combine varying wavelength regions into a single monolithic structure with on-chip processing. A specific ASTMP goal is to develop and demonstrate a full-up FPA with integrated readouts and imaging processing capability.

Implementation: An active DEA exists with France covering new developments in IR. Another DEA with France may also contribute to ASTMP goals and objectives. Additionally, an umbrella agreement concerning Technology Research and Development Projects (TRDP) exists with France, and might serve as an additional exchange mechanism via the establishment of a Project Agreement (PA) covering this technology.


Dr. Rodney Smith
Army Materiel Command
5001 Eisenhower Blvd
Alexandria, VA 22333-0001
e-mail: [email protected]


Mr. Richard Pei
Fort Monmouth, NJ 07703
e-mail: [email protected]


Mr. Stephen Cohn
Army Research Laboratory
2800 Powder Mill Road
Adelphi, MD 20783-1197
e-mail: [email protected]