Annex A. Science And Technology Objectives (STOs)
Army Science and Technology Master Plan (ASTMP 1997)

III.F.06. Multi-Mission/Common Modular UAV Sensors. Multi-mission/common modular UAV Sensors will demonstrate low cost, EO/IR, multispectral and lightweight integrated MTI/SAR payloads for future tactical UAVs. Common modular payload will be form/fit/interface compatible and share common electronics, data link, data compression. The radar payload will build upon successes in the current low-cost radar development program and likely will utilize MIMIC. The EO payload will leverage high quantum efficiency, 3-5 micron staring arrays. Sensor payloads will provide enhanced reconnaissance, surveillance, battle damage assessment, and targeting for non-line of sight weapons. By FY97, mission requirements, payload constraints, and common modular interfaces will be determined. By FY98, candidate sensors and signal processor selected and development initiated. By FY99, complete sensor development and payload integration, and initiate captive flight tests. By FY00, complete performance testing and operational demonstration in support of early entry, deep attack, mine detection, and non-line of sight masked targeting mission scenarios.

Supports: Masked Targeting, TUAV, SARD-B, DARO, JPO UAV.

John Cervini Carolyn Nash Bob Bolling
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